Electronics Heat Transfer Analysis Applications
Electronics thermal analysis can be computed across multiple scales, from component models that focus on junction temperature to enclosure design optimization for packaged and cooled systems. Our software and services team have provided analysis for aircraft electronics, automotive instrument panels, underhood circuitry protection, and even outdoor electrical boxes under the Arizona sun.
Much of our work is proprietary so the examples here do not fully represent the capabilities of our software and engineering team. Contact us to review your electronics simulation requirements and we can direct you to a software solution or an engineering services approach.
Learn more about Thermal Analysis Technologies
Our thermal modeling team performs CFD analysis on thermal systems. They focus almost exclusively on solving multimode heat transfer problems. We frequently combine CFD analysis with thermal modeling in RadTherm.
Electronics thermal analysis can be computed across multiple scales, from component models to enclosure design optimization for packaged and cooled systems. We have analyzed aircraft electronics, automotive instrument panels, underhood circuitry protection, and even outdoor electrical boxes.
Heat shield performance hinges on several key factors, including position, shape, material properties, and conduction within and between material layers. RadTherm allows extremely rapid and intuitive manipulation of these parameters.
CFD Experts employ our RadTherm Software to improve thermal simulation performance when computing transient solutions, when surface to surface radiation plays an important role, when they need early concept analysis, and when their systems will be subject to environmental thermal loads.
Our Human Thermal Simulation Module is the state-of-the-art technology for predicting human thermal comfort, safety, and effectiveness. All thermoregulatory responses are supported and based on activity level.
