
Transient Solids with Volume Mesh SupportSolid objects can be imported using a volume mesh and the internal temperature distribution solved under steady-state or transient conditions. This enables improved accuracy for objects with complex internal conduction pathways, low-density objects where thermal diffusion is of interest, and where cross sectional visualizations are important for commuicating results. Volume mesh parts can interact with the wide array of planar mesh objects, such as standard, highly conductive, and multilayer parts, giving the user the widest selection of modeling options availble in a single simulation.

Version 10.0 includes numerous enhancements to the Human Simulation Module. Those updates include, but are not limited to:
Radial and Spherical ConductionParts with planar meshes can have improved conduction for thick-walled or solid spherical and cylindrical objects: user can define the conduction type to "Cylindrical" or "Spherical." This setting changes the solution network to represent the varying mass, surface area and conductive resistance of each layer as a function of outer and inner radius.
Improved Management of Part LayersManaging the layers in complex parts is now easier than ever. Version 10.0 includes the ability to insert, duplicate, and delete layers within a multi-layer part with a simple click of the mouse. There is also the abiliity to have front layers or back layers aligned if both parts are multi-layer.
Display Enhancements with Lighting and ShadingVisualizing parts and vehicles is improved, especially for high-density mesh Display Lighted Graphics option allows for lighting in the graphics window, which shades parts of the model to provide a more realistic feeling of depth when the mesh is turned off. This feature also introduces a new color scale called Color Scale 3. This is now the default color scheme in the software.
Geometry Edit by VertexManipulation of geometry is now easily defined using vertex locations- allowing design changes or basic edits directly within our software.